Article

Article title MODELING OF MECHANICAL STRESSES IN FILM SENSORS
Authors A.S. Isaeva, E.A. Ryndin
Section SECTION III. NANOSYSTEMS TECHNOLOGY
Month, Year 09, 2014 @en
Index UDC 536.416:539.377
DOI
Abstract The dependence between the stress state of the loaded object monitoring, representing as the aluminum plate containing formal defect (section nonzero thickness) and the stress state of the film sensing element, representing as a thin film of copper deposited on the polyimide film (providing dielectric isolation) located on the surface of the object, for the purpose of developing a sensor monitoring cracks is considered. The solution of two-dimensional symmetric problem uniaxial elastic tension of the sample with a surface crack, opening under the influence of loading perpendicular to the crack and the film sensing element executed using software package ANSYS is received. The error introducing into the model by neglect mechanical properties dielectric film (polyimide) is analyzed. The modeling results show the possibility of detection surface defects like cracks on condition the selection optimum film thickness sensor and taking into account properties of dielectric film.

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Keywords Stress-strain state; uniaxial tensile; modeling.
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