Article

Article title HIGH SPEED PRINTED-CIRCUIT WIRING SIMULATIONS
Authors T.A. Suanov
Section SECTION III. RADIO EQUIPMENT AND DEVICES
Month, Year 11, 2013 @en
Index UDC 621.396.6
DOI
Abstract Pre-layout signal integrity simulations have been presented using computer-aided design of high-speed multilayer printed circuit board (Mentor Graphics Expedition-PCB). Printed-circuit wiring simulations have been accomplished to find out signal integrity and electromagnetic compatibility problems. Long transmission lines requiring matching have been investigated, as a result timing diagrams of the signals in matched and mismatched lines are presented upon different matching techniques. Coupling transmission lines have been analyzed in cases of tracing in outer and inner layers; timing diagrams of cross talks are performed. Methods for handling such problems were reviewed, and its effectiveness have been examined. Recommendations for designing printed-circuit wiring in high-speed systems based on printed-circuit boards are provided. Also module for electromagnetic compatibility analyzing was presented. Simulation of single transmission line printed on outer layer of printed-circuit board have been carried out, spectrum diagrams are derived. Place of pre-layout signal integrity simulations and its reasonability in the printed-circuit board design have been discussed.

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Keywords Multilayer printed circuit board; printed line; signal integrity; electromagnetic compatibility; printed line matching; cross coupling.
References 1. Кечиев Л.Н. Проектирование печатных плат для цифровой быстродействующей аппаратуры. – М.: ООО “Группа ИТД”, 2007. – 616 с.

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